Intel CEO to visit Odisha for 3DGS ground-breaking ceremony; production likely in 2 yrs: Official
New Delhi: PC chip major Intel CEO Lip-Bu Tan is likely to visit Odisha later this year for the ground-breaking ceremony of 3D Glass Solutions’ semiconductor plant, a senior state government official said on Wednesday.
The ground-breaking ceremony of the silicon carbide company SicSem is scheduled for next month, and the commercial production of chips is expected to start in two years, Odisha Electronics and IT Department Principal Secretary Vishal Kumar Dev told PTI.
