Semiconductor tech boost for Odisha as Intel, 3DGS sign $3.3 billion pact
The Odisha government has signed an MoU with Intel and 3D Glass Solutions (3DGS) to bring substrate manufacturing technology to India, with the project expected to attract $3.3 billion investment in phases.
The pact was signed in California on Thursday. Union electronics and information technology minister Ashwini Vaishnaw congratulated the Odisha government, Intel and 3DGS, saying the initiative would strengthen India’s semiconductor ecosystem.
