Samsung Electronics ships HBM4E chip samples to global customers

SEOUL: Samsung Electronics said on Friday it has started shipping samples of its latest high-bandwidth memory (HBM) chip, or the 12-layer HBM4E, marking ‌what ⁠it ⁠said was the industry’s first shipment of such products.

The South Korean tech company said the new chip represents a more than 20% increase in speed performance over its previous-generation HBM4 products.

Samsung said the chip ⁠uses its ‌latest 1c DRAM process technology, or sixth-generation 10-nanometer-class DRAM, alongside Samsung’s 4-nanometer ⁠foundry logic base die.