Odisha signs pact with Intel, 3DGS to bring substrate manufacturing tech to India

New Delhi: India’s semiconductor manufacturing push received another boost after Union Electronics and IT Minister Ashwini Vaishnaw announced on Friday that the government of Odisha, Intel and 3DGS have signed a Memorandum of Understanding (MoU) to bring substrate manufacturing technology to India.

Sharing the development on X, Vaishnaw said, “Congratulations to the Govt. of Odisha, Intel and 3DGS on signing an MoU to bring substrate manufacturing technology to India. This will further advance semiconductor ecosystem in India.”