May 5, 2026 – Page 4

Daily Archives: May 5, 2026

Palantir lifts annual revenue forecast on robust US government demand

Elon Musk settles SEC lawsuit over Twitter disclosures, $1.5 million fine imposed

Elon Musk sought settlement with OpenAI before Oakland trial, filing shows

Elon Musk vs OpenAI trial enters second week

Blackstone vehicle aims to raise over $1.7 billion in US IPO to fund data center bet

STMicro targets more than $3 billion in space chip revenue as demand grows

Centre eyeing minimum design skills target for component scheme companies

Intel appoints Qualcomm’s Alex Katouzian to lead PC & physical AI business

Lattice Semiconductor to buy software firm AMI in $1.65 billion deal

Samsung union in Korea splits as non-chip workers exit over semiconductor-focused bonus demands

MediaTek hires former TSMC executive to boost AI chip packaging

Ceramic components maker Three-Circle seeks to raise up to $1 billion in Hong Kong listing

Air India SATS inks pact to fast-track Samsung Data Systems shipments from Noida airport

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Nokia bets big on AI-driven network infrastructure, sees double-digit growth

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EU recommends member states to not use Huwaei, ZTE in connectivity infrastructure

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HFCL wins ₹84 crore deal to supply optical fibre cable to private telco

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Vodafone Idea may need over $8 bn capital infusion to be a strong third telco: BoFA Securities

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Daily Archives: May 5, 2026

Palantir lifts annual revenue forecast on robust US government demand

Elon Musk settles SEC lawsuit over Twitter disclosures, $1.5 million fine imposed

Elon Musk sought settlement with OpenAI before Oakland trial, filing shows

Elon Musk vs OpenAI trial enters second week

Blackstone vehicle aims to raise over $1.7 billion in US IPO to fund data center bet

STMicro targets more than $3 billion in space chip revenue as demand grows

Centre eyeing minimum design skills target for component scheme companies

Intel appoints Qualcomm’s Alex Katouzian to lead PC & physical AI business

Lattice Semiconductor to buy software firm AMI in $1.65 billion deal

Samsung union in Korea splits as non-chip workers exit over semiconductor-focused bonus demands

MediaTek hires former TSMC executive to boost AI chip packaging

Ceramic components maker Three-Circle seeks to raise up to $1 billion in Hong Kong listing

Air India SATS inks pact to fast-track Samsung Data Systems shipments from Noida airport

Nokia bets big on AI-driven network infrastructure, sees double-digit growth

EU recommends member states to not use Huwaei, ZTE in connectivity infrastructure

HFCL wins ₹84 crore deal to supply optical fibre cable to private telco

Vodafone Idea may need over $8 bn capital infusion to be a strong third telco: BoFA Securities

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Daily Archives: May 5, 2026

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