MediaTek hires former TSMC executive to boost AI chip packaging

TAIPEI: Taiwanese chip designer MediaTek said it has appointed former TSMC executive Douglas Yu as a part-time adviser as it steps up advanced packaging work and expands into the AI ‌chip market.

Yu joined TSMC in 1994 and retired in 2025, holding a range of roles in backend research and development. He played a key part in developing TSMC’s advanced packaging technologies, including its CoWoS (Chip on ⁠Wafer on ‌Substrate).

CoWoS is a key chip packaging technology widely used in artificial ⁠intelligence chips, including Nvidia chips.