Chip designer Broadcom expects to sell 1 million 3D stacked chips by 2027

Artificial intelligence chip designer Broadcom said that it expects to sell at least 1 million chips by 2027 based on its stacked design tech, an executive told Reuters on Wednesday.

The forecast, ​which Reuters is the first to report, marks a new product and sales target for Broadcom that could represent a revenue stream potentially worth billions of dollars.

Harish Bharadwaj, vice president of product marketing, said the 1 million chips the company projects it will ‌sell are based ⁠on an ⁠approach Broadcom developed that stacks two chips on top of one another, allowing the distinct pieces of silicon to be tightly bound ​to improve the speed at which data can flow from one chip to another.