Innodisk Unveils the New ‘AI on Dragonwing’ Computing Series with the First EXMP-Q911 COM-HPC Mini Module Powered by Qualcomm’s SoC
TAIPEI, Jan. 6, 2026 /PRNewswire/ — Innodisk, a leading global AI solution provider, announced the launch of its new AI on Dragonwing computing series, developed in collaboration with Qualcomm Technologies, Inc[1]. The flagship EXMP-Q911 COM-HPC Mini module delivers up to 100 TOPS of AI performance while maintaining low power consumption and wide-temperature reliability from -40°C to 85°C. The Qualcomm Dragonwing™ SoCs also offers longevity support through 2038, ensuring supply stability for long-term industrial deployments. As the first product line within Innodisk’s AI on ARM portfolio, the series opens a new chapter for customers seeking sustainable and scalable ARM-based Edge AI solutions.
