{"id":991889,"date":"2026-02-14T08:21:53","date_gmt":"2026-02-14T02:51:53","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=991889"},"modified":"2026-02-14T08:33:28","modified_gmt":"2026-02-14T03:03:28","slug":"semicon-tools-maker-kla-to-invest-up-to-400-mn-in-tamil-nadu-open-rd-campus","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2026\/02\/14\/semicon-tools-maker-kla-to-invest-up-to-400-mn-in-tamil-nadu-open-rd-campus\/","title":{"rendered":"Semicon tools maker KLA to invest up to $400 mn in Tamil Nadu, open R&amp;D campus"},"content":{"rendered":"<p>NEW DELHI: Semiconductor tools maker KLA Corporation on Friday said it has signed a Memorandum of Understanding (MoU) with the Tamil Nadu government to set up a new research &amp; development and innovation campus in Chennai. <\/p>\n<p>As part of the pact, the American wafer fab equipment supplier intends to invest up to $400 million (~\u20b93,600 crore) over the next 10 years, underscoring its long-term commitment to India as a strategic hub for R&amp;D, software, and AI-led semiconductor innovation.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>NEW DELHI: Semiconductor tools maker KLA Corporation on Friday said it has signed a Memorandum of Understanding (MoU) with the Tamil Nadu government to set up a new research &amp; development and innovation campus in Chennai. As part of the pact, the American wafer fab equipment supplier intends to invest up to $400 million (~\u20b93,600 crore) over the next 10 years, underscoring its long-term commitment to India as a strategic hub for R&amp;D, software, and AI-led semiconductor innovation.<\/p>\n","protected":false},"author":8,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[59,4,10],"tags":[],"class_list":["post-991889","post","type-post","status-publish","format-standard","hentry","category-it-2-the-economic-times","category-newspapers","category-the-economic-times"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/991889","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/8"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=991889"}],"version-history":[{"count":0,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/991889\/revisions"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=991889"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=991889"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=991889"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}