{"id":983399,"date":"2026-01-05T08:59:54","date_gmt":"2026-01-05T03:29:54","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=983399"},"modified":"2026-01-05T09:01:11","modified_gmt":"2026-01-05T03:31:11","slug":"projects-under-design-linked-incentive-for-semiconductors-showing-signs-of-growth","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2026\/01\/05\/projects-under-design-linked-incentive-for-semiconductors-showing-signs-of-growth\/","title":{"rendered":"Projects under Design Linked Incentive for semiconductors showing signs of growth"},"content":{"rendered":"<p>New Delhi [India], January 4 (ANI): Projects supported under the government&#8217;s Design Linked Incentive (DLI) scheme are scaling rapidly, with 16 tape-outs, 6 ASIC chips, 10 patents, over 1,000 engineers engaged, and over 3x private investment leveraged. <\/p>\n<p>Ministry of Electronics and Information Technology&#8217;s (MeitY) Design Linked Incentive (DLI) Scheme under the Semicon India Programme aims to build a self-reliant, globally competitive chip design ecosystem.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>New Delhi [India], January 4 (ANI): Projects supported under the government&#8217;s Design Linked Incentive (DLI) scheme are scaling rapidly, with 16 tape-outs, 6 ASIC chips, 10 patents, over 1,000 engineers engaged, and over 3x private investment leveraged. Ministry of Electronics and Information Technology&#8217;s (MeitY) Design Linked Incentive (DLI) Scheme under the Semicon India Programme aims to build a self-reliant, globally competitive chip design ecosystem.<\/p>\n","protected":false},"author":8,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[91,4,24],"tags":[],"class_list":["post-983399","post","type-post","status-publish","format-standard","hentry","category-it-2-the-tribune","category-newspapers","category-the-tribune"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/983399","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/8"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=983399"}],"version-history":[{"count":0,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/983399\/revisions"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=983399"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=983399"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=983399"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}