{"id":951047,"date":"2025-07-30T08:30:13","date_gmt":"2025-07-30T03:00:13","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=951047"},"modified":"2025-07-30T08:40:24","modified_gmt":"2025-07-30T03:10:24","slug":"lg-electronics-dives-into-semiconductor-equipment-developing-hbm-chip-for-ai-applications","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2025\/07\/30\/lg-electronics-dives-into-semiconductor-equipment-developing-hbm-chip-for-ai-applications\/","title":{"rendered":"LG Electronics dives into semiconductor equipment, developing HBM chip for AI applications"},"content":{"rendered":"<p>Seoul [South Korea], July 29 (ANI): LG Electronics is making a strategic push into the semiconductor equipment sector, focusing on building key machinery for producing high-bandwidth memory (HBM) chips essential for AI applications, as reported by the Korea Herald. <\/p>\n<p>The South Korean tech firm recently confirmed that its in-house research team, the Production Engineering Research Institute, has begun developing a hybrid bonder, an advanced chip packaging device. The machine is intended for use in manufacturing HBM chips, which are central to powering AI technologies.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Seoul [South Korea], July 29 (ANI): LG Electronics is making a strategic push into the semiconductor equipment sector, focusing on building key machinery for producing high-bandwidth memory (HBM) chips essential for AI applications, as reported by the Korea Herald. The South Korean tech firm recently confirmed that its in-house research team, the Production Engineering Research Institute, has begun developing a hybrid bonder, an advanced chip packaging device. The machine is intended for use in manufacturing HBM chips, which are central to powering AI technologies.<\/p>\n","protected":false},"author":8,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[91,4,24],"tags":[],"class_list":["post-951047","post","type-post","status-publish","format-standard","hentry","category-it-2-the-tribune","category-newspapers","category-the-tribune"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/951047","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/8"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=951047"}],"version-history":[{"count":0,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/951047\/revisions"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=951047"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=951047"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=951047"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}