{"id":890759,"date":"2024-12-24T10:31:11","date_gmt":"2024-12-24T05:01:11","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=890759"},"modified":"2024-12-24T10:31:11","modified_gmt":"2024-12-24T05:01:11","slug":"apples-m5-chips-may-have-a-new-design-how-can-it-improve-next-gen-iphones-and-macs","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2024\/12\/24\/apples-m5-chips-may-have-a-new-design-how-can-it-improve-next-gen-iphones-and-macs\/","title":{"rendered":"Apple\u2019s M5 chips may have a new design: How can it improve next-gen iPhones and Macs"},"content":{"rendered":"<p>Apple is expected to change its chip design for the upcoming Mac models. Apple analyst Ming-Chi Kuo has predicted that the M5 Pro, M5 Max, and M5 Ultra chips will use a new packaging technology called System-in-Integrated-Chips-Molding-Horizontal (SoIC-mH). This technology will allow for multiple chips to be integrated into a single package, potentially improving performance and efficiency. Currently, Apple&#8217;s M-series chips are single-unit SoCs, which have contributed to their performance advantage over previous Intel processors. However, the new packaging technology will enable Apple to push the boundaries of performance and efficiency further.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Apple is expected to change its chip design for the upcoming Mac models. Apple analyst Ming-Chi Kuo has predicted that the M5 Pro, M5 Max, and M5 Ultra chips will use a new packaging technology called System-in-Integrated-Chips-Molding-Horizontal (SoIC-mH). This technology will allow for multiple chips to be integrated into a single package, potentially improving performance and efficiency. Currently, Apple&#8217;s M-series chips are single-unit SoCs, which have contributed to their performance advantage over previous Intel processors. However, the new packaging technology will enable Apple to push the boundaries of performance and efficiency further.<\/p>\n","protected":false},"author":9,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[87,4,11],"tags":[],"class_list":["post-890759","post","type-post","status-publish","format-standard","hentry","category-it-2-the-times-of-india","category-newspapers","category-the-times-of-india"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/890759","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/9"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=890759"}],"version-history":[{"count":0,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/890759\/revisions"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=890759"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=890759"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=890759"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}