{"id":868497,"date":"2024-10-21T08:38:00","date_gmt":"2024-10-21T03:08:00","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=868497"},"modified":"2024-10-21T08:38:00","modified_gmt":"2024-10-21T03:08:00","slug":"us-plans-up-to-1-6-billion-towards-chip-packaging-tech-2","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2024\/10\/21\/us-plans-up-to-1-6-billion-towards-chip-packaging-tech-2\/","title":{"rendered":"US plans up to $1.6 billion towards chip packaging tech"},"content":{"rendered":"<p>Washington: The United States expects to direct up to $1.6 billion in funding to boost semiconductor packaging, the Commerce Department said Friday, as Washington seeks to stay ahead in tech while competition with China intensifies.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Washington: The United States expects to direct up to $1.6 billion in funding to boost semiconductor packaging, the Commerce Department said Friday, as Washington seeks to stay ahead in tech while competition with China intensifies.<\/p>\n","protected":false},"author":10,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[59,4,10],"tags":[],"class_list":["post-868497","post","type-post","status-publish","format-standard","hentry","category-it-2-the-economic-times","category-newspapers","category-the-economic-times"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/868497","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/10"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=868497"}],"version-history":[{"count":0,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/868497\/revisions"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=868497"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=868497"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=868497"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}