{"id":851972,"date":"2024-09-04T19:28:18","date_gmt":"2024-09-04T13:58:18","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=851972"},"modified":"2024-09-05T08:26:20","modified_gmt":"2024-09-05T02:56:20","slug":"sk-hynix-says-hbm3e-12-layer-chips-to-start-mass-production-this-month","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2024\/09\/04\/sk-hynix-says-hbm3e-12-layer-chips-to-start-mass-production-this-month\/","title":{"rendered":"SK Hynix says HBM3E 12-layer chips to start mass production this month"},"content":{"rendered":"<p>SK Hynix, the world&#8217;s second-largest memory chip maker, will start mass production of HBM3E 12-layer chips by the end of this month, a senior executive said on Wednesday. <\/p>\n<p>Justin Kim, president and head of the company&#8217;s AI Infra division, made the comment at the Semicon Taiwan industry forum in Taipei. <\/p>\n<p>In July, the South Korean company disclosed plans to ship the next versions of HBM chips &#8211; the 12-layer HBM3E &#8211; starting in the fourth quarter and the HBM4 starting in the second half of 2025.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>SK Hynix, the world&#8217;s second-largest memory chip maker, will start mass production of HBM3E 12-layer chips by the end of this month, a senior executive said on Wednesday. Justin Kim, president and head of the company&#8217;s AI Infra division, made the comment at the Semicon Taiwan industry forum in Taipei. In July, the South Korean company disclosed plans to ship the next versions of HBM chips &#8211; the 12-layer HBM3E &#8211; starting in the fourth quarter and the HBM4 starting in the second half of 2025.<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[7],"tags":[],"class_list":["post-851972","post","type-post","status-publish","format-standard","hentry","category-it-2"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/851972","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=851972"}],"version-history":[{"count":0,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/851972\/revisions"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=851972"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=851972"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=851972"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}