{"id":850136,"date":"2024-08-30T10:51:55","date_gmt":"2024-08-30T05:21:55","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=850136"},"modified":"2024-08-30T10:52:10","modified_gmt":"2024-08-30T05:22:10","slug":"in-new-chip-push-centre-ready-with-15-billion-blueprint","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2024\/08\/30\/in-new-chip-push-centre-ready-with-15-billion-blueprint\/","title":{"rendered":"In new chip push, Centre ready with $15-billion blueprint"},"content":{"rendered":"<p>AFTER HAVING committed nearly all of the $10 billion in subsidies under its ambitious semiconductor manufacturing incentive policy, the government has prepared a blueprint for the second phase of the scheme \u2014 it could increase the outlay of the programme to $15 billion, offer capital support for raw materials and gases used in chip manufacturing, and reduce subsidies for assembly and testing plants, The Indian Express has learnt.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>AFTER HAVING committed nearly all of the $10 billion in subsidies under its ambitious semiconductor manufacturing incentive policy, the government has prepared a blueprint for the second phase of the scheme \u2014 it could increase the outlay of the programme to $15 billion, offer capital support for raw materials and gases used in chip manufacturing, and reduce subsidies for assembly and testing plants, The Indian Express has learnt.<\/p>\n","protected":false},"author":8,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[4],"tags":[],"class_list":["post-850136","post","type-post","status-publish","format-standard","hentry","category-newspapers"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/850136","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/8"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=850136"}],"version-history":[{"count":0,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/850136\/revisions"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=850136"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=850136"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=850136"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}