{"id":849206,"date":"2024-08-29T08:42:43","date_gmt":"2024-08-29T03:12:43","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=849206"},"modified":"2024-08-29T08:53:35","modified_gmt":"2024-08-29T03:23:35","slug":"lt-semiconductor-c-dac-sign-pact-to-jointly-work-on-indigenous-chip-tech","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2024\/08\/29\/lt-semiconductor-c-dac-sign-pact-to-jointly-work-on-indigenous-chip-tech\/","title":{"rendered":"L&amp;T Semiconductor, C-DAC sign pact to jointly work on indigenous chip tech"},"content":{"rendered":"<p>L&amp;T Semiconductor Technologies has signed a memorandum of understanding with government-backed Centre for Development of Advanced Computing for jointly working to develop local chip technology and the ecosystem around it, according to a statement on Wednesday. <\/p>\n<p>The MoU will focus on a comprehensive framework for collaborative research, development, and training initiatives, with an emphasis on the creation of Make-in-India Integrated Circuit (IC), System-on-Chip (SoC) and Electronics System Design &amp; Manufacturing (ESDM) solutions for automotive, industrial, and energy applications, the semiconductor company said.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>L&amp;T Semiconductor Technologies has signed a memorandum of understanding with government-backed Centre for Development of Advanced Computing for jointly working to develop local chip technology and the ecosystem around it, according to a statement on Wednesday. The MoU will focus on a comprehensive framework for collaborative research, development, and training initiatives, with an emphasis on the creation of Make-in-India Integrated Circuit (IC), System-on-Chip (SoC) and Electronics System Design &amp; Manufacturing (ESDM) solutions for automotive, industrial, and energy applications, the semiconductor company said.<\/p>\n","protected":false},"author":8,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[9,34,4],"tags":[],"class_list":["post-849206","post","type-post","status-publish","format-standard","hentry","category-business-standard-newspapers","category-it-2-business-standard-newspapers","category-newspapers"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/849206","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/8"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=849206"}],"version-history":[{"count":0,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/849206\/revisions"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=849206"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=849206"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=849206"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}