{"id":831086,"date":"2024-07-09T17:28:54","date_gmt":"2024-07-09T11:58:54","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=831086"},"modified":"2024-07-10T09:16:26","modified_gmt":"2024-07-10T03:46:26","slug":"samsung-electronics-wins-cutting-edge-ai-chip-order-from-japans-preferred-networks","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2024\/07\/09\/samsung-electronics-wins-cutting-edge-ai-chip-order-from-japans-preferred-networks\/","title":{"rendered":"Samsung Electronics wins cutting-edge AI chip order from Japan&#8217;s Preferred Networks"},"content":{"rendered":"<p>Samsung Electronics said on Tuesday it won an order from Japanese artificial intelligence company Preferred Networks to make chips for AI applications using the South Korean firm&#8217;s 2-nanometre foundry process and advanced chip packaging service. <\/p>\n<p>It is the first order Samsung has revealed for its cutting-edge 2-nanometre chip contract manufacturing process. Samsung did not elaborate on the size of the order. <\/p>\n<p>he chips will be made using high-tech chip architecture known as gate all-around (GAA) and multiple chips will be integrated in one package to enhance inter-connection speed and reduce size, Samsung said in a statement. <\/p>\n<p>South Korea&#8217;s Gaonchips Co designed the chips, Samsung said. <\/p>\n<p>The chips will go toward Preferred Networks&#8217; high-performance computing hardware for generative AI technologies such as large language models, Junichiro Makino, Preferred Networks vice president and chief technology officer of computing architecture, said in the statement.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Samsung Electronics said on Tuesday it won an order from Japanese artificial intelligence company Preferred Networks to make chips for AI applications using the South Korean firm&#8217;s 2-nanometre foundry process and advanced chip packaging service. It is the first order Samsung has revealed for its cutting-edge 2-nanometre chip contract manufacturing process. Samsung did not elaborate on the size of the order. he chips will be made using high-tech chip architecture known as gate all-around (GAA) and multiple chips will be integrated in one package to enhance inter-connection speed and reduce size, Samsung said in a statement. South Korea&#8217;s Gaonchips Co [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[7],"tags":[],"class_list":["post-831086","post","type-post","status-publish","format-standard","hentry","category-it-2"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/831086","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=831086"}],"version-history":[{"count":0,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/831086\/revisions"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=831086"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=831086"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=831086"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}