{"id":1047693,"date":"2026-11-07T07:30:57","date_gmt":"2026-11-07T02:00:57","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=1047693"},"modified":"2026-11-07T08:00:23","modified_gmt":"2026-11-07T02:30:23","slug":"paras-semiconductors-broadpak-join-hands-to-build-advanced-semiconductor-packaging-capabilities","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2026\/11\/07\/paras-semiconductors-broadpak-join-hands-to-build-advanced-semiconductor-packaging-capabilities\/","title":{"rendered":"Paras Semiconductors, BroadPak join hands to build advanced semiconductor packaging capabilities"},"content":{"rendered":"<p>New Delhi, An Indian defence engineering company has joined hands with a US-based firm to accelerate the development of advanced semiconductor packaging capabilities in India, according to an official statement. <\/p>\n<p>The collaboration will combine Paras Semiconductors&#8217; manufacturing ambitions in opto-electronics, photonics and co-packaged optics with BroadPak&#8217;s technology expertise in advanced semiconductor packaging, heterogeneous integration and chiplet-based system architectures, it said.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>New Delhi, An Indian defence engineering company has joined hands with a US-based firm to accelerate the development of advanced semiconductor packaging capabilities in India, according to an official statement. The collaboration will combine Paras Semiconductors&#8217; manufacturing ambitions in opto-electronics, photonics and co-packaged optics with BroadPak&#8217;s technology expertise in advanced semiconductor packaging, heterogeneous integration and chiplet-based system architectures, it said.<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[59,4,10],"tags":[],"class_list":["post-1047693","post","type-post","status-publish","format-standard","hentry","category-it-2-the-economic-times","category-newspapers","category-the-economic-times"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1047693","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=1047693"}],"version-history":[{"count":1,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1047693\/revisions"}],"predecessor-version":[{"id":1047722,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1047693\/revisions\/1047722"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=1047693"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=1047693"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=1047693"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}