{"id":1042219,"date":"2026-10-10T08:40:37","date_gmt":"2026-10-10T03:10:37","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=1042219"},"modified":"2026-10-10T08:53:23","modified_gmt":"2026-10-10T03:23:23","slug":"applied-materials-intel-collaborate-at-epic-center-to-accelerate-ai-chipmaking-advanced-packaging","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2026\/10\/10\/applied-materials-intel-collaborate-at-epic-center-to-accelerate-ai-chipmaking-advanced-packaging\/","title":{"rendered":"Applied Materials, Intel collaborate at EPIC Center to accelerate AI chipmaking, advanced packaging"},"content":{"rendered":"<p>NEW DELHI: Materials engineering major Applied Materials on Thursday announced a collaboration with Intel Corporation to accelerate the development of chipmaking innovations for next-generation transistors, interconnects, and advanced packaging technologies. <\/p>\n<p>The joint effort brings together capabilities from Applied&#8217;s EPIC Center in Silicon Valley and Intel&#8217;s R&amp;D campus in Hillsboro, Oregon, to shorten time-to-market for advanced semiconductor technologies essential to artificial intelligence computing.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>NEW DELHI: Materials engineering major Applied Materials on Thursday announced a collaboration with Intel Corporation to accelerate the development of chipmaking innovations for next-generation transistors, interconnects, and advanced packaging technologies. The joint effort brings together capabilities from Applied&#8217;s EPIC Center in Silicon Valley and Intel&#8217;s R&amp;D campus in Hillsboro, Oregon, to shorten time-to-market for advanced semiconductor technologies essential to artificial intelligence computing.<\/p>\n","protected":false},"author":8,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[59,4,10],"tags":[],"class_list":["post-1042219","post","type-post","status-publish","format-standard","hentry","category-it-2-the-economic-times","category-newspapers","category-the-economic-times"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1042219","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/8"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=1042219"}],"version-history":[{"count":1,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1042219\/revisions"}],"predecessor-version":[{"id":1042243,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1042219\/revisions\/1042243"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=1042219"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=1042219"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=1042219"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}