Full-stack AI and HPC infrastructure provider Submer has signed a collaboration agreement with Intel to deliver next-generation artificial intelligence and high-performance computing data center solutions across the Middle East, Africa, and Turkey. <\/p>\n
Under the agreement, Intel will contribute its compute platforms, validated reference architectures, and technology roadmap, while Submer provides end-to-end engineering spanning advisory, design, build, power, thermal solutions, and IT integration. <\/p>\n
The strategic partnership aims to address growing regional demand for AI and HPC capacity, which is placing unprecedented requirements on data center infrastructure regarding compute density, thermal performance, and power utilisation. <\/p>\n
A core focus of the tie-up is the joint development and validation of reference architectures for AI and high-density deployments, combining Intel platforms with Submer’s liquid-cooled infrastructure designs. <\/p>\n
“Customers in this region are not short of ambition on AI and HPC. What they need is a route from design intent to operating infrastructure that holds together technically,” said Khalid Aljamed, general manager (Middle East, Africa and Turkey) at Submer. <\/p>\n
Aljamed added that working alongside Intel allows Submer to pair proven compute platforms with regional engineering and delivery capabilities, offering customers a single coherent architecture rather than disconnected implementation decisions. <\/p>\n
The two companies will jointly target sovereign, enterprise, hyperscale, telecom, and public-sector clients, with Submer supporting feasibility assessments for both new-build facilities and retrofits of existing sites. <\/p>\n
“Organisations across the region are rapidly transitioning from experimental AI pilots to production-scale deployments faster than traditional data centers were built to handle,” said Ahmad Alabduljabbar, general manager (Saudi Arabia) at Intel. <\/p>\n
Alabduljabbar noted that combining Intel’s reference architectures with Submer’s advanced immersion cooling expertise delivers a practical pathway to high-density AI environments critical to realising Saudi Arabia’s Vision 2030 digital leadership ambitions. <\/p>\n
Initial operations will prioritise reference architecture development and customer proof-of-concept engagements in target markets, alongside technical workshops, executive briefings, and infrastructure integration support across the region.<\/p>\n","protected":false},"excerpt":{"rendered":"
Full-stack AI and HPC infrastructure provider Submer has signed a collaboration agreement with Intel to deliver next-generation artificial intelligence and high-performance computing data center solutions across the Middle East, Africa, and Turkey. Under the agreement, Intel will contribute its compute platforms, validated reference architectures, and technology roadmap, while Submer provides end-to-end engineering spanning advisory, design, build, power, thermal solutions, and IT integration. The strategic partnership aims to address growing regional demand for AI and HPC capacity, which is placing unprecedented requirements on data center infrastructure regarding compute density, thermal performance, and power utilisation. A core focus of the tie-up is […]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[7],"tags":[],"class_list":["post-1037798","post","type-post","status-publish","format-standard","hentry","category-it-2"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1037798","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=1037798"}],"version-history":[{"count":1,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1037798\/revisions"}],"predecessor-version":[{"id":1037799,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1037798\/revisions\/1037799"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=1037798"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=1037798"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=1037798"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}