{"id":1036824,"date":"2026-09-19T07:49:46","date_gmt":"2026-09-19T02:19:46","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=1036824"},"modified":"2026-09-19T07:57:44","modified_gmt":"2026-09-19T02:27:44","slug":"indiesemic-kaynes-semicon-sign-pact-for-osat-collaboration","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2026\/09\/19\/indiesemic-kaynes-semicon-sign-pact-for-osat-collaboration\/","title":{"rendered":"IndieSemiC, Kaynes Semicon sign pact for OSAT collaboration"},"content":{"rendered":"<p>NEW DELHI: IndieSemiC, a homegrown fabless chip design startup, on Friday said it has signed a Memorandum of Understanding (MoU) with Kaynes Semicon for outsourced semiconductor assembly and test (OSAT). <\/p>\n<p>The pact establishes a framework for the qualification, assembly, and testing of QFN, BGA, and other mutually agreed semiconductor packages, in support of IndieSemiC&#8217;s growing portfolio of ultra-low-power, compact SiP modules and discrete semiconductor devices, according to a joint statement.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>NEW DELHI: IndieSemiC, a homegrown fabless chip design startup, on Friday said it has signed a Memorandum of Understanding (MoU) with Kaynes Semicon for outsourced semiconductor assembly and test (OSAT). The pact establishes a framework for the qualification, assembly, and testing of QFN, BGA, and other mutually agreed semiconductor packages, in support of IndieSemiC&#8217;s growing portfolio of ultra-low-power, compact SiP modules and discrete semiconductor devices, according to a joint statement.<\/p>\n","protected":false},"author":8,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[59,4,10],"tags":[],"class_list":["post-1036824","post","type-post","status-publish","format-standard","hentry","category-it-2-the-economic-times","category-newspapers","category-the-economic-times"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1036824","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/8"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=1036824"}],"version-history":[{"count":1,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1036824\/revisions"}],"predecessor-version":[{"id":1036840,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1036824\/revisions\/1036840"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=1036824"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=1036824"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=1036824"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}