{"id":1036755,"date":"2026-09-18T10:41:30","date_gmt":"2026-09-18T05:11:30","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=1036755"},"modified":"2026-09-18T11:49:42","modified_gmt":"2026-09-18T06:19:42","slug":"semicon-2026-day-1-rs-1-lakh-crore-investment-commitments-16-mous-and-announcements-push-india-semiconductor-ecosystem-deeper","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2026\/09\/18\/semicon-2026-day-1-rs-1-lakh-crore-investment-commitments-16-mous-and-announcements-push-india-semiconductor-ecosystem-deeper\/","title":{"rendered":"Semicon 2026 Day 1: Rs 1 lakh crore investment commitments, 16 MoUs and announcements push India semiconductor ecosystem deeper"},"content":{"rendered":"<p>New Delhi [India], September 17 (ANI): The first day of SEMICON India 2026 saw the government lay out a wider roadmap for the next phase of India&#8217;s semiconductor programme, with around Rs 1 lakh crore in investment commitments, plans to create close to one lakh jobs and a series of agreements spanning chip manufacturing, materials, packaging, design and talent development.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>New Delhi [India], September 17 (ANI): The first day of SEMICON India 2026 saw the government lay out a wider roadmap for the next phase of India&#8217;s semiconductor programme, with around Rs 1 lakh crore in investment commitments, plans to create close to one lakh jobs and a series of agreements spanning chip manufacturing, materials, packaging, design and talent development.<\/p>\n","protected":false},"author":8,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[91,4,24],"tags":[],"class_list":["post-1036755","post","type-post","status-publish","format-standard","hentry","category-it-2-the-tribune","category-newspapers","category-the-tribune"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1036755","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/8"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=1036755"}],"version-history":[{"count":1,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1036755\/revisions"}],"predecessor-version":[{"id":1036780,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1036755\/revisions\/1036780"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=1036755"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=1036755"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=1036755"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}