The Centre is targeting training 1 lakh individuals under the Semicon 2.0 initiative to build a talent pool for domestic manufacturing facilities, according to Union Minister of Electronics and IT Ashwini Vaishnaw. <\/p>\n
Speaking at the inauguration of Semicon India 2026 on Thursday, being held from September 17 to September 19, Vaishnaw outlined the next phase of the India Semiconductor Mission (ISM), which will be structured around six core pillars. <\/p>\n
“Under Semicon 2.0, we will take on the big task of developing technician, cleanroom, and factory floor talent, and we will be targeting 1 lakh talent to be developed, who will be employed straightaway in the factories that are coming up in India, and it will be a global pool of talent that will be available,” he said. <\/p>\n
The minister noted that while the first-edition of the programme established the initial foundation for domestic ecosystem building, the second phase will expand the national strategy across design, machines and materials, fabrication, advanced packaging, research and development, and talent. <\/p>\n
Under the design pillar, the government aims to support at least 200 chip design startups and companies, scaling up from the 105 startups supported in the first phase, of which 20 secured \u20b9800 crore in venture capital funding. <\/p>\n
The second pillar focuses on semiconductor equipment, maintenance, gases, and chemicals, with Vaishnaw thanking industry partners for announcing a $5 billion investment commitment during the conference. <\/p>\n
The policy framework will also seek additional display, memory, silicon, compound, and logic fabrication facilities, alongside expanding advanced 3D packaging units beyond existing projects coming up in Odisha.” <\/p>\n
“We already have a 3D packaging unit coming up in Odisha. We would like to have much more progress in the advanced packaging because that is a very important part of the entire value chain,” the minister said. <\/p>\n
On research and development, the government plans to fund industry-driven applied research projects in synchronization with Indian academic institutions. <\/p>\n
Highlighting progress in design talent development, Vaishnaw stated that 70,000 design engineers have been trained within four years using EDA tools deployed across 400 universities nationwide, with the Semiconductor Laboratory at Mohali supporting chip tape-outs. <\/p>\n
“From Rourkela and Jammu to Puducherry and Meghalaya, every part of the country, today, more than 400 universities have world’s latest EDA tools from Cadence, Siemens, and Synopsys. All these EDA tools are today available to the students.” <\/p>\n
The inauguration also marked the launch of commercial production at two new facilities, Suchi Semicon in Surat, Gujarat, and Continental Device India Limited (CDIL) in Mohali, Punjab, bringing India’s total operational commercial semiconductor facilities to five alongside Micron, Kaynes, and CG Semi.<\/p>\n
“For the industry, this milestone represents the growing transition of India\u2019s semiconductor vision into operational capacity, particularly in advanced packaging and testing,” said Ashok Mehta, chairman, Suchi Semicon. “As the ecosystem evolves, packaging and testing will play a critical role in strengthening the country\u2019s semiconductor value chain.”<\/p>\n
\u201cIESA applauds Suchi Semicon and CDIL on the commercial launch of semiconductor chip production in India. These milestones are a strong validation of the momentum India\u2019s semiconductor ecosystem is building, from policy intent to real manufacturing and commercial output,” said Ashok Chandak, president of IESA and SEMI India. “Every commercial launch strengthens India\u2019s credibility, builds industry confidence and moves us closer to a resilient, globally trusted semiconductor value chain.”<\/p>\n
Kathir Thandavarayan, partner, Deloitte India, said in a statement that with potential investments of around $50 billion expected across the semiconductor value chain over the next three to four years, India is also expected to account for nearly 10% of global semiconductor output by FY2030. “ISM 2.0 and Semicon India 2026 provide an important platform to accelerate this momentum and strengthen India\u2019s position in the global semiconductor value chain,” he added.<\/p>\n","protected":false},"excerpt":{"rendered":"
The Centre is targeting training 1 lakh individuals under the Semicon 2.0 initiative to build a talent pool for domestic manufacturing facilities, according to Union Minister of Electronics and IT Ashwini Vaishnaw. Speaking at the inauguration of Semicon India 2026 on Thursday, being held from September 17 to September 19, Vaishnaw outlined the next phase of the India Semiconductor Mission (ISM), which will be structured around six core pillars. “Under Semicon 2.0, we will take on the big task of developing technician, cleanroom, and factory floor talent, and we will be targeting 1 lakh talent to be developed, who will […]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[7],"tags":[],"class_list":["post-1036459","post","type-post","status-publish","format-standard","hentry","category-it-2"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1036459","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=1036459"}],"version-history":[{"count":1,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1036459\/revisions"}],"predecessor-version":[{"id":1036474,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1036459\/revisions\/1036474"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=1036459"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=1036459"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=1036459"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}