{"id":1032362,"date":"2026-09-01T08:07:30","date_gmt":"2026-09-01T02:37:30","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=1032362"},"modified":"2026-09-01T08:28:20","modified_gmt":"2026-09-01T02:58:20","slug":"semicon-2-0-notified-to-widen-push-beyond-fabs-will-add-100000-engineers","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2026\/09\/01\/semicon-2-0-notified-to-widen-push-beyond-fabs-will-add-100000-engineers\/","title":{"rendered":"Semicon 2.0 notified to widen push beyond fabs, will add 100,000 engineers"},"content":{"rendered":"<p>India will look to develop another 100,000 semiconductor engineers as part of its \u20b91.27-lakh-crore Semicon 2.0 programme, as the government broadens its chip strategy from attracting fabrication plants to building capabilities across the semiconductor value chain. <\/p>\n<p>The government on Monday notified detailed guidelines for Semicon 2.0, offering incentives for chip design, equipment and materials, fabrication plants, advanced packaging, research and development and talent creation.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>India will look to develop another 100,000 semiconductor engineers as part of its \u20b91.27-lakh-crore Semicon 2.0 programme, as the government broadens its chip strategy from attracting fabrication plants to building capabilities across the semiconductor value chain. The government on Monday notified detailed guidelines for Semicon 2.0, offering incentives for chip design, equipment and materials, fabrication plants, advanced packaging, research and development and talent creation.<\/p>\n","protected":false},"author":8,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[63,4,12],"tags":[],"class_list":["post-1032362","post","type-post","status-publish","format-standard","hentry","category-it-2-the-financial-express","category-newspapers","category-the-financial-express"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1032362","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/8"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=1032362"}],"version-history":[{"count":1,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1032362\/revisions"}],"predecessor-version":[{"id":1032384,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1032362\/revisions\/1032384"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=1032362"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=1032362"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=1032362"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}