The Centre on Monday notified the Semicon 2.0 scheme with a \u20b91.27 lakh crore outlay to strengthen the domestic semiconductor manufacturing ecosystem in the country and supply chains. <\/p>\n
The scheme spans six key segments, including chip design by Indian firms, setting up units for capital equipment required for chip production, semiconductor fabs, chip assembly, packaging and testing, and more. <\/p>\n
“The government has decided to provide…sustained policy support to the semiconductor sector in India by notifying the Semicon 2.0 Scheme for the development of semiconductor design and manufacturing ecosystem in India,\u201d the notification said. <\/p>\n
“Semicon 2.0 provides fiscal support to various verticals across the complete value chain of the semiconductor industry, ranging from chip design, fabrication and packaging to various segments of the semiconductor ecosystem,” it added. <\/p>\n
The scheme aims to build resilient, trusted, and sovereign semiconductor technologies with a focus on design, development, and deployment of “target segment technologies for national strategic and critical infrastructure”, according to a report by news agency PTI. <\/p>\n
It will target local development of semiconductor Intellectual Property (IP) cores, Chips, System-on-Chips (SoCs), and modules for electronic products, as may be identified from time to time based on national importance and strategic priorities. <\/p>\n
“To achieve this, building blocks will be developed, including standard IPs for various types of compute, memory, RF, power, networking, snsors, etc.,” the notification said. <\/p>\n
India Electronics and Semiconductor Association (IESA) said it sees the potential for the programme to catalyse more than \u20b95 lakh crore of cumulative private and industry investment over the next five to seven years, across fabs, ATMP\/OSAT, equipment and materials, design, R&D and the wider supply chain. <\/p>\n
“R&D focus on 7-3 nm pathway, Silicon Photonics, micro LEDs , compound semiconductors and support to OCI and large corporates in fabless sector and manufacturing related skilling are notable differentiations,” said Ashok Chandak, president, IESA and SEMI India. <\/p>\n
Jaya Jagadish, senior vice president & country head (silicon design engineering), AMD India, said in a statement that ISM 2.0 will boost semiconductor sector talent. <\/p>\n
\u201cIndia also needs a clear design-to-commercialization pipeline that moves ideas from IP creation through prototyping to globally competitive products,\u201d Jagadish said. \u201cAMD\u2019s experience in India shows what can be achieved when strong talent is matched with the right investment environment. ISM 2.0 can help establish this environment at scale.\u201d<\/p>\n","protected":false},"excerpt":{"rendered":"
The Centre on Monday notified the Semicon 2.0 scheme with a \u20b91.27 lakh crore outlay to strengthen the domestic semiconductor manufacturing ecosystem in the country and supply chains. The scheme spans six key segments, including chip design by Indian firms, setting up units for capital equipment required for chip production, semiconductor fabs, chip assembly, packaging and testing, and more. “The government has decided to provide…sustained policy support to the semiconductor sector in India by notifying the Semicon 2.0 Scheme for the development of semiconductor design and manufacturing ecosystem in India,\u201d the notification said. “Semicon 2.0 provides fiscal support to various […]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[7],"tags":[],"class_list":["post-1032271","post","type-post","status-publish","format-standard","hentry","category-it-2"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1032271","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=1032271"}],"version-history":[{"count":1,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1032271\/revisions"}],"predecessor-version":[{"id":1032278,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1032271\/revisions\/1032278"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=1032271"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=1032271"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=1032271"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}