India\u2019s semiconductor ambitions may run into challenges, including equipment and talent, while transitioning towards advanced node chips, said a senior executive at the Institute of Electrical and Electronics Engineers (IEEE). <\/p>\n
“The challenge lies in the technology node we want to achieve. When we talk about very advanced nodes and emerging technology nodes, the fabrication challenges are significant,\u201d Santhosh Sivasubramani, senior member, IEEE, told ETElectronicsWorld in an interview. <\/p>\n
The US-based IEEE runs roadmap groups that forecast technology evolutions, drive the development of standards, and develop international roadmaps for devices, systems, and semiconductors. <\/p>\n
Furthermore, there are hurdles in setting up advanced greenfield facilities that require the \u201cright instruments\u201d and trained personnel to operate them, he said. \u201cYou have to build a skilled workforce capable of managing these operations.\u201d <\/p>\n
The Centre in July approved the Semicon 2.0 programme with a financial outlay of \u20b91.27 lakh crore, which will have a focus on developing six key segments: design; machines and materials; establishment of more fabs; strengthening domestic OSAT\/ATMP ecosystem; research and development; and talent development. <\/p>\n
The first-edition of the ambitious semiconductor initiative has attracted over \u20b91.64 lakh crore in investment from a clutch of international and domestic manufacturers. Of these, the US-based Micron Technology, Kaynes, and CG Semi have started commercial production, while another will begin operations this year. <\/p>\n
India\u2019s semiconductor journey has started with 28nm to 110nm as the node, with the government now aspiring to develop more advanced nodes in collaboration with homegrown and multinational innovation centres. <\/p>\n
The capital-intensive semiconductor foundries, at present, operate in a handful of countries including China, the United States (US), South Korea, and Taiwan. India\u2019s first fab is scheduled to be commissioned in 2028. <\/p>\n
However, the IEEE executive said that India will gradually transition to the semiconductor fab phase. “We are not trying to make everything indigenous from day one. We started with packaging, and now the next focus would be on fabrication.” <\/p>\n
Furthermore, the Indian industry is actively working on materials discovery to reduce dependence on materials sourced from restricted regions, such as China, to become more self-reliant, according to IEEE. <\/p>\n
\u201cWe need to compete with advanced economies at scale. We have the resources, we have a huge market, and now we are trying to capitalise on those strengths,\u201d Sivasubramani said, adding that the India Semiconductor Mission (ISM) 2.0 would address some industry-wide bottlenecks. <\/p>\n
\u201cThe administrative and technical challenges have been clearly laid out, and we are on the right track. That is how I see the future of ISM 2.0.\u201d <\/p>\n
\u201cWe bring together working groups from across the globe, particularly in India, along with the IEEE Standards Association office, as well as leaders, so that they can identify the potential pitfalls and what needs to be overcome,\u201d Sivasubramani said. \u201cIt is so that we can overcome limitations and develop completely indigenous, sovereign solutions.\u201d<\/p>\n","protected":false},"excerpt":{"rendered":"
India\u2019s semiconductor ambitions may run into challenges, including equipment and talent, while transitioning towards advanced node chips, said a senior executive at the Institute of Electrical and Electronics Engineers (IEEE). “The challenge lies in the technology node we want to achieve. When we talk about very advanced nodes and emerging technology nodes, the fabrication challenges are significant,\u201d Santhosh Sivasubramani, senior member, IEEE, told ETElectronicsWorld in an interview. The US-based IEEE runs roadmap groups that forecast technology evolutions, drive the development of standards, and develop international roadmaps for devices, systems, and semiconductors. Furthermore, there are hurdles in setting up advanced greenfield […]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[7],"tags":[],"class_list":["post-1030423","post","type-post","status-publish","format-standard","hentry","category-it-2"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1030423","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=1030423"}],"version-history":[{"count":1,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1030423\/revisions"}],"predecessor-version":[{"id":1030434,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1030423\/revisions\/1030434"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=1030423"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=1030423"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=1030423"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}