{"id":1026644,"date":"2026-08-06T09:58:29","date_gmt":"2026-08-06T04:28:29","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=1026644"},"modified":"2026-08-06T10:50:48","modified_gmt":"2026-08-06T05:20:48","slug":"samsung-stacks-high-bandwidth-memory-chips-on-top-of-ai-chips-in-3d-memory-push-promises-up-to-eightfold-performance","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2026\/08\/06\/samsung-stacks-high-bandwidth-memory-chips-on-top-of-ai-chips-in-3d-memory-push-promises-up-to-eightfold-performance\/","title":{"rendered":"Samsung stacks high-bandwidth memory chips on top of AI chips in 3D memory push, promises up to eightfold performance"},"content":{"rendered":"<p>Seoul [South Korea], August 5 (ANI): Samsung Electronics is placing high-bandwidth memory directly on top of AI processors as part of a 3D memory architecture push designed to lower power consumption and deliver faster data transfers, according to a  news report by The Korea Herald. <\/p>\n<p>The tech giant unveiled concept models of two 3D architectures, dubbed zHBM and zNAND-O, at the Future of Memory and Storage 2026 event held at the Santa Clara Convention Centre in California. Samsung described both concept models as industry firsts.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Seoul [South Korea], August 5 (ANI): Samsung Electronics is placing high-bandwidth memory directly on top of AI processors as part of a 3D memory architecture push designed to lower power consumption and deliver faster data transfers, according to a news report by The Korea Herald. The tech giant unveiled concept models of two 3D architectures, dubbed zHBM and zNAND-O, at the Future of Memory and Storage 2026 event held at the Santa Clara Convention Centre in California. Samsung described both concept models as industry firsts.<\/p>\n","protected":false},"author":8,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[91,4,24],"tags":[],"class_list":["post-1026644","post","type-post","status-publish","format-standard","hentry","category-it-2-the-tribune","category-newspapers","category-the-tribune"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1026644","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/8"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=1026644"}],"version-history":[{"count":1,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1026644\/revisions"}],"predecessor-version":[{"id":1026760,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1026644\/revisions\/1026760"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=1026644"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=1026644"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=1026644"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}