{"id":1023827,"date":"2026-07-27T07:37:30","date_gmt":"2026-07-27T02:07:30","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=1023827"},"modified":"2026-07-27T07:37:30","modified_gmt":"2026-07-27T02:07:30","slug":"samsung-electronics-wins-200-billion-broadcom-ai-chip-partnership-boosting-foundry-push","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2026\/07\/27\/samsung-electronics-wins-200-billion-broadcom-ai-chip-partnership-boosting-foundry-push\/","title":{"rendered":"Samsung Electronics wins $200 billion Broadcom AI chip partnership, boosting foundry push"},"content":{"rendered":"<p>SEOUL, July 25 (Reuters) &#8211; Samsung Electronics said on Saturday it struck a pact with U.S. chip designer Broadcom to widen cooperation across memory chips, contract chip making and advanced packaging envisaged to exceed $200 billion until 2030.<\/p>\n<p>Winning long-term production commitments from Broadcom, one of the world&#8217;s leading custom AI chip designers, could boost utilisation at Samsung&#8217;s advanced manufacturing facilities to pull ahead in the race to supply AI chips.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>SEOUL, July 25 (Reuters) &#8211; Samsung Electronics said on Saturday it struck a pact with U.S. chip designer Broadcom to widen cooperation across memory chips, contract chip making and advanced packaging envisaged to exceed $200 billion until 2030. Winning long-term production commitments from Broadcom, one of the world&#8217;s leading custom AI chip designers, could boost utilisation at Samsung&#8217;s advanced manufacturing facilities to pull ahead in the race to supply AI chips.<\/p>\n","protected":false},"author":11,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[55,13,4],"tags":[],"class_list":["post-1023827","post","type-post","status-publish","format-standard","hentry","category-it-2-live-mint","category-live-mint","category-newspapers"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1023827","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/11"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=1023827"}],"version-history":[{"count":1,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1023827\/revisions"}],"predecessor-version":[{"id":1023830,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1023827\/revisions\/1023830"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=1023827"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=1023827"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=1023827"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}