{"id":1023759,"date":"2026-07-27T07:20:11","date_gmt":"2026-07-27T01:50:11","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=1023759"},"modified":"2026-07-27T07:22:29","modified_gmt":"2026-07-27T01:52:29","slug":"samsung-elec-wins-200-billion-broadcom-ai-chip-partnership-boosting-foundry-push","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2026\/07\/27\/samsung-elec-wins-200-billion-broadcom-ai-chip-partnership-boosting-foundry-push\/","title":{"rendered":"Samsung Elec wins $200 billion Broadcom AI chip partnership, boosting foundry push"},"content":{"rendered":"<p>SEOUL: Samsung Electronics said on Saturday it struck a pact with U.S. chip designer Broadcom to widen cooperation across memory chips, contract chip making and advanced packaging envisaged to exceed $200 billion until 2030. <\/p>\n<p>Winning long-term production commitments from Broadcom, one of the world&#8217;s leading custom AI chip designers, could boost utilisation \u200cat Samsung&#8217;s \u2060advanced manufacturing \u2060facilities to pull ahead in the race to supply AI chips.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>SEOUL: Samsung Electronics said on Saturday it struck a pact with U.S. chip designer Broadcom to widen cooperation across memory chips, contract chip making and advanced packaging envisaged to exceed $200 billion until 2030. Winning long-term production commitments from Broadcom, one of the world&#8217;s leading custom AI chip designers, could boost utilisation \u200cat Samsung&#8217;s \u2060advanced manufacturing \u2060facilities to pull ahead in the race to supply AI chips.<\/p>\n","protected":false},"author":8,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[59,4,10],"tags":[],"class_list":["post-1023759","post","type-post","status-publish","format-standard","hentry","category-it-2-the-economic-times","category-newspapers","category-the-economic-times"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1023759","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/8"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=1023759"}],"version-history":[{"count":1,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1023759\/revisions"}],"predecessor-version":[{"id":1023784,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1023759\/revisions\/1023784"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=1023759"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=1023759"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=1023759"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}