{"id":1023174,"date":"2026-07-24T07:40:44","date_gmt":"2026-07-24T02:10:44","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=1023174"},"modified":"2026-07-24T07:42:00","modified_gmt":"2026-07-24T02:12:00","slug":"besi-orders-more-than-double-as-ai-and-hybrid-bonding-tech-drive-demand-2","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2026\/07\/24\/besi-orders-more-than-double-as-ai-and-hybrid-bonding-tech-drive-demand-2\/","title":{"rendered":"Besi orders more than double as AI and hybrid bonding tech drive demand"},"content":{"rendered":"<p>BE Semiconductor Industries (Besi) on Thursday reported quarterly orders significantly above last year&#8217;s level, fuelled by strong demand for AI, hybrid bonding, photonics and data centres. <\/p>\n<p>Investors are betting on rising demand for Besi&#8217;s hybrid bonding solutions, a chip-packaging technology that enables two chips to \u200cbe directly \u2060bonded together, \u2060citing the company&#8217;s first-mover advantage as AI-driven demand accelerates.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>BE Semiconductor Industries (Besi) on Thursday reported quarterly orders significantly above last year&#8217;s level, fuelled by strong demand for AI, hybrid bonding, photonics and data centres. Investors are betting on rising demand for Besi&#8217;s hybrid bonding solutions, a chip-packaging technology that enables two chips to \u200cbe directly \u2060bonded together, \u2060citing the company&#8217;s first-mover advantage as AI-driven demand accelerates.<\/p>\n","protected":false},"author":8,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[59,4,10],"tags":[],"class_list":["post-1023174","post","type-post","status-publish","format-standard","hentry","category-it-2-the-economic-times","category-newspapers","category-the-economic-times"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1023174","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/8"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=1023174"}],"version-history":[{"count":1,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1023174\/revisions"}],"predecessor-version":[{"id":1023201,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1023174\/revisions\/1023201"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=1023174"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=1023174"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=1023174"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}