{"id":1022891,"date":"2026-07-22T16:41:22","date_gmt":"2026-07-22T11:11:22","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=1022891"},"modified":"2026-07-23T07:10:28","modified_gmt":"2026-07-23T01:40:28","slug":"paras-semiconductors-to-invest-%e2%82%b96200-for-greenfield-osat-facility-in-madhya-pradesh","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2026\/07\/22\/paras-semiconductors-to-invest-%e2%82%b96200-for-greenfield-osat-facility-in-madhya-pradesh\/","title":{"rendered":"Paras Semiconductors to invest \u20b96,200 for greenfield OSAT facility in Madhya Pradesh"},"content":{"rendered":"<p>Paras Defence and Space Technologies on Wednesday said its subsidiary, Paras Semiconductors, would invest \u20b96,200 crore to set up a greenfield integrated circuit (IC) packaging outsourced semiconductor assembly and test (OSAT) facility in the Indore-Ujjain region of Madhya Pradesh. <\/p>\n<p>The facility will undertake advanced packaging operations including 3D heterogeneous integration, 2.5D\/3D advanced packaging, hybrid bonding, ultra-high-density fan-out packaging, chiplet integration, wafer bumping, flip-chip assembly, testing and reliability, Paras said in a regulatory filing. <\/p>\n<p>To this extent, Paras Semiconductors has signed a Memorandum of Understanding (MoU) with the state government\u2019s Department of Science and Technology. <\/p>\n<p>\u201cParas Semiconductors and MP State Electronics Development Corporation (MPSeDC) will integrate their respective expertise and resources to collaboratively facilitate the establishment of a greenfield advanced IC packaging OSAT in Madhya Pradesh,\u201d Paras added.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Paras Defence and Space Technologies on Wednesday said its subsidiary, Paras Semiconductors, would invest \u20b96,200 crore to set up a greenfield integrated circuit (IC) packaging outsourced semiconductor assembly and test (OSAT) facility in the Indore-Ujjain region of Madhya Pradesh. The facility will undertake advanced packaging operations including 3D heterogeneous integration, 2.5D\/3D advanced packaging, hybrid bonding, ultra-high-density fan-out packaging, chiplet integration, wafer bumping, flip-chip assembly, testing and reliability, Paras said in a regulatory filing. To this extent, Paras Semiconductors has signed a Memorandum of Understanding (MoU) with the state government\u2019s Department of Science and Technology. \u201cParas Semiconductors and MP State Electronics [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[7],"tags":[],"class_list":["post-1022891","post","type-post","status-publish","format-standard","hentry","category-it-2"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1022891","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=1022891"}],"version-history":[{"count":1,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1022891\/revisions"}],"predecessor-version":[{"id":1022912,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1022891\/revisions\/1022912"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=1022891"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=1022891"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=1022891"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}