{"id":1017762,"date":"2026-06-30T09:29:32","date_gmt":"2026-06-30T03:59:32","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=1017762"},"modified":"2026-06-30T09:46:43","modified_gmt":"2026-06-30T04:16:43","slug":"korea-gets-a-usd-583-billion-chip-boost-as-samsung-sk-hynix-to-build-new-capacities","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2026\/06\/30\/korea-gets-a-usd-583-billion-chip-boost-as-samsung-sk-hynix-to-build-new-capacities\/","title":{"rendered":"Korea gets a USD 583 billion chip boost as Samsung, SK Hynix to build new capacities"},"content":{"rendered":"<p>Seoul [Korea], June 29, (ANI): South Korean chip giants Samsung and SK Hynix are scaling their semiconductor ambitions by committing nearly USD583 billion for two new fabrication sites, according to a report in the Korea Herald. <\/p>\n<p>At the Presidential briefing, the two companies unveiled plans to build these facilities that will include four memory fabs in the southwest and advanced packaging plants in the North and South Chungcheong provinces, the report added.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Seoul [Korea], June 29, (ANI): South Korean chip giants Samsung and SK Hynix are scaling their semiconductor ambitions by committing nearly USD583 billion for two new fabrication sites, according to a report in the Korea Herald. At the Presidential briefing, the two companies unveiled plans to build these facilities that will include four memory fabs in the southwest and advanced packaging plants in the North and South Chungcheong provinces, the report added.<\/p>\n","protected":false},"author":8,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[91,4,24],"tags":[],"class_list":["post-1017762","post","type-post","status-publish","format-standard","hentry","category-it-2-the-tribune","category-newspapers","category-the-tribune"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1017762","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/8"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=1017762"}],"version-history":[{"count":1,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1017762\/revisions"}],"predecessor-version":[{"id":1017795,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1017762\/revisions\/1017795"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=1017762"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=1017762"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=1017762"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}