{"id":1016053,"date":"2026-06-22T07:50:55","date_gmt":"2026-06-22T02:20:55","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=1016053"},"modified":"2026-06-22T07:55:35","modified_gmt":"2026-06-22T02:25:35","slug":"intel-hires-former-sk-hynix-chief-lee-seok-hee-to-lead-advanced-packaging","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2026\/06\/22\/intel-hires-former-sk-hynix-chief-lee-seok-hee-to-lead-advanced-packaging\/","title":{"rendered":"Intel hires former SK hynix chief Lee Seok-hee to lead advanced packaging"},"content":{"rendered":"<p>Intel has appointed former CEO of SK hynix and SK On Lee Seok-hee as a senior vice president in its foundry business, amid the US chipmaker&#8217;s push into advanced semiconductor packaging. <\/p>\n<p>According to a report by The Korea Herald, Intel announced Thursday that Lee will oversee advanced packaging, system integration, back-end technology development and back-end manufacturing at Intel Foundry. He will report directly to CEO Lip-Bu Tan. <\/p>\n<p>Intel Foundry is establishing advanced packaging as a focused business with dedicated leadership, a direction underscored by Lee&#8217;s appointment to strengthen the division, the company explained.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Intel has appointed former CEO of SK hynix and SK On Lee Seok-hee as a senior vice president in its foundry business, amid the US chipmaker&#8217;s push into advanced semiconductor packaging. According to a report by The Korea Herald, Intel announced Thursday that Lee will oversee advanced packaging, system integration, back-end technology development and back-end manufacturing at Intel Foundry. He will report directly to CEO Lip-Bu Tan. Intel Foundry is establishing advanced packaging as a focused business with dedicated leadership, a direction underscored by Lee&#8217;s appointment to strengthen the division, the company explained.<\/p>\n","protected":false},"author":8,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[59,4,10],"tags":[],"class_list":["post-1016053","post","type-post","status-publish","format-standard","hentry","category-it-2-the-economic-times","category-newspapers","category-the-economic-times"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1016053","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/8"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=1016053"}],"version-history":[{"count":1,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1016053\/revisions"}],"predecessor-version":[{"id":1016054,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1016053\/revisions\/1016054"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=1016053"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=1016053"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=1016053"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}