{"id":1015696,"date":"2026-06-19T10:26:43","date_gmt":"2026-06-19T04:56:43","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=1015696"},"modified":"2026-06-19T16:21:43","modified_gmt":"2026-06-19T10:51:43","slug":"tsmc-amkor-sign-10-year-deal-to-boost-advanced-chip-packaging-in-us","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2026\/06\/19\/tsmc-amkor-sign-10-year-deal-to-boost-advanced-chip-packaging-in-us\/","title":{"rendered":"TSMC, Amkor sign 10-year deal to boost advanced chip packaging in US"},"content":{"rendered":"<p>Taipei [Taiwan], June 18 (ANI): Taiwan Semiconductor Manufacturing Co (TSMC) and US-based chip packaging and testing provider Amkor Technology have signed a 10-year agreement aimed at expanding advanced semiconductor packaging and testing capabilities in the United States, according to a news report by Focus Taiwan. <\/p>\n<p>In a statement released Tuesday US time, Amkor said the partnership will support the development of a more integrated semiconductor supply chain in Arizona, where TSMC is investing heavily in chip manufacturing facilities, the report added.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Taipei [Taiwan], June 18 (ANI): Taiwan Semiconductor Manufacturing Co (TSMC) and US-based chip packaging and testing provider Amkor Technology have signed a 10-year agreement aimed at expanding advanced semiconductor packaging and testing capabilities in the United States, according to a news report by Focus Taiwan. In a statement released Tuesday US time, Amkor said the partnership will support the development of a more integrated semiconductor supply chain in Arizona, where TSMC is investing heavily in chip manufacturing facilities, the report added.<\/p>\n","protected":false},"author":8,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[91,4,24],"tags":[],"class_list":["post-1015696","post","type-post","status-publish","format-standard","hentry","category-it-2-the-tribune","category-newspapers","category-the-tribune"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1015696","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/8"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=1015696"}],"version-history":[{"count":1,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1015696\/revisions"}],"predecessor-version":[{"id":1015721,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1015696\/revisions\/1015721"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=1015696"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=1015696"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=1015696"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}