{"id":1014257,"date":"2026-06-13T09:08:49","date_gmt":"2026-06-13T03:38:49","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=1014257"},"modified":"2026-06-13T09:33:46","modified_gmt":"2026-06-13T04:03:46","slug":"cadfem-apac-and-silterra-malaysia-partner-to-advance-semiconductor-innovation-through-simulation-driven-engineering","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2026\/06\/13\/cadfem-apac-and-silterra-malaysia-partner-to-advance-semiconductor-innovation-through-simulation-driven-engineering\/","title":{"rendered":"CADFEM APAC and SilTerra Malaysia Partner to Advance Semiconductor Innovation Through Simulation-Driven Engineering"},"content":{"rendered":"<p>HYDERABAD, India and SEBERANG PERAI, Malaysia, June 12, 2026 \/PRNewswire\/ &#8212; The semiconductor industry is under growing pressure to deliver more capable technologies while reducing development time, cost, and risk. <\/p>\n<p>In response to this growing industry need, CADFEM APAC, a leading provider of engineering simulation and digital engineering solutions, has signed a Memorandum of Understanding (MoU) with SilTerra Malaysia Sdn. Bhd., one of Malaysia&#8217;s leading semiconductor foundries and fabless design service providers.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>HYDERABAD, India and SEBERANG PERAI, Malaysia, June 12, 2026 \/PRNewswire\/ &#8212; The semiconductor industry is under growing pressure to deliver more capable technologies while reducing development time, cost, and risk. In response to this growing industry need, CADFEM APAC, a leading provider of engineering simulation and digital engineering solutions, has signed a Memorandum of Understanding (MoU) with SilTerra Malaysia Sdn. Bhd., one of Malaysia&#8217;s leading semiconductor foundries and fabless design service providers.<\/p>\n","protected":false},"author":8,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[91,4,24],"tags":[],"class_list":["post-1014257","post","type-post","status-publish","format-standard","hentry","category-it-2-the-tribune","category-newspapers","category-the-tribune"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1014257","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/8"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=1014257"}],"version-history":[{"count":1,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1014257\/revisions"}],"predecessor-version":[{"id":1014310,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1014257\/revisions\/1014310"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=1014257"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=1014257"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=1014257"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}