{"id":1011133,"date":"2026-05-30T11:28:51","date_gmt":"2026-05-30T05:58:51","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=1011133"},"modified":"2026-05-30T11:44:23","modified_gmt":"2026-05-30T06:14:23","slug":"indias-semiconductor-push-gains-momentum-as-odisha-signs-chip-technology-mou-with-intel-3dgs","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2026\/05\/30\/indias-semiconductor-push-gains-momentum-as-odisha-signs-chip-technology-mou-with-intel-3dgs\/","title":{"rendered":"India&#8217;s semiconductor push gains momentum as Odisha signs chip technology MoU with Intel, 3DGS"},"content":{"rendered":"<p>New Delhi [India], May 29 (ANI): India&#8217;s semiconductor manufacturing push received another boost after Union Electronics and IT Minister Ashwini Vaishnaw announced on Friday that the Government of Odisha, Intel and 3DGS have signed a Memorandum of Understanding (MoU) to bring substrate manufacturing technology to India. <\/p>\n<p>Sharing the development on X, Vaishnaw said, &#8220;Congratulations to the Govt. of Odisha, Intel and 3DGS on signing an MoU to bring substrate manufacturing technology to India. This will further advance semiconductor ecosystem in India.&#8221;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>New Delhi [India], May 29 (ANI): India&#8217;s semiconductor manufacturing push received another boost after Union Electronics and IT Minister Ashwini Vaishnaw announced on Friday that the Government of Odisha, Intel and 3DGS have signed a Memorandum of Understanding (MoU) to bring substrate manufacturing technology to India. Sharing the development on X, Vaishnaw said, &#8220;Congratulations to the Govt. of Odisha, Intel and 3DGS on signing an MoU to bring substrate manufacturing technology to India. This will further advance semiconductor ecosystem in India.&#8221;<\/p>\n","protected":false},"author":8,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[91,4,24],"tags":[],"class_list":["post-1011133","post","type-post","status-publish","format-standard","hentry","category-it-2-the-tribune","category-newspapers","category-the-tribune"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1011133","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/8"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=1011133"}],"version-history":[{"count":1,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1011133\/revisions"}],"predecessor-version":[{"id":1011162,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1011133\/revisions\/1011162"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=1011133"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=1011133"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=1011133"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}