{"id":1010897,"date":"2026-05-30T09:22:24","date_gmt":"2026-05-30T03:52:24","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=1010897"},"modified":"2026-05-30T09:28:42","modified_gmt":"2026-05-30T03:58:42","slug":"odisha-signs-pact-with-intel-3dgs-to-bring-substrate-manufacturing-tech-to-india","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2026\/05\/30\/odisha-signs-pact-with-intel-3dgs-to-bring-substrate-manufacturing-tech-to-india\/","title":{"rendered":"Odisha signs pact with Intel, 3DGS to bring substrate manufacturing tech to India"},"content":{"rendered":"<p>New Delhi: India&#8217;s semiconductor manufacturing push received another boost after Union Electronics and IT Minister Ashwini Vaishnaw announced on Friday that the government of Odisha, Intel and 3DGS have signed a Memorandum of Understanding (MoU) to bring substrate manufacturing technology to India. <\/p>\n<p>Sharing the development on X, Vaishnaw said, &#8220;Congratulations to the Govt. of Odisha, Intel and 3DGS on signing an MoU to bring substrate manufacturing technology to India. This will further advance semiconductor ecosystem in India.&#8221;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>New Delhi: India&#8217;s semiconductor manufacturing push received another boost after Union Electronics and IT Minister Ashwini Vaishnaw announced on Friday that the government of Odisha, Intel and 3DGS have signed a Memorandum of Understanding (MoU) to bring substrate manufacturing technology to India. Sharing the development on X, Vaishnaw said, &#8220;Congratulations to the Govt. of Odisha, Intel and 3DGS on signing an MoU to bring substrate manufacturing technology to India. This will further advance semiconductor ecosystem in India.&#8221;<\/p>\n","protected":false},"author":8,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[59,4,10],"tags":[],"class_list":["post-1010897","post","type-post","status-publish","format-standard","hentry","category-it-2-the-economic-times","category-newspapers","category-the-economic-times"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1010897","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/8"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=1010897"}],"version-history":[{"count":1,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1010897\/revisions"}],"predecessor-version":[{"id":1010921,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1010897\/revisions\/1010921"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=1010897"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=1010897"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=1010897"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}