{"id":1010257,"date":"2026-05-27T10:09:10","date_gmt":"2026-05-27T04:39:10","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=1010257"},"modified":"2026-05-27T10:15:55","modified_gmt":"2026-05-27T04:45:55","slug":"sk-hynixs-ihbm-to-cut-thermal-resistance-by-30-to-combat-ai-memory-overheating","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2026\/05\/27\/sk-hynixs-ihbm-to-cut-thermal-resistance-by-30-to-combat-ai-memory-overheating\/","title":{"rendered":"SK hynix&#8217;s iHBM to cut thermal resistance by 30% to combat AI memory overheating"},"content":{"rendered":"<p>Seoul [South Korea], May 26 (ANI): SK hynix&#8217;s iHBM tackles heat choking next-gen high-bandwidth memory (HBM) by building cooling channels directly into its HBM chips. According to a news report by The Korea Herald on Tuesday, the South Korean chipmaker introduced this advanced packaging technology to combat rising temperatures, which represent a significant engineering obstacle that limits how far artificial intelligence memory scales.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Seoul [South Korea], May 26 (ANI): SK hynix&#8217;s iHBM tackles heat choking next-gen high-bandwidth memory (HBM) by building cooling channels directly into its HBM chips. According to a news report by The Korea Herald on Tuesday, the South Korean chipmaker introduced this advanced packaging technology to combat rising temperatures, which represent a significant engineering obstacle that limits how far artificial intelligence memory scales.<\/p>\n","protected":false},"author":8,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[91,4,24],"tags":[],"class_list":["post-1010257","post","type-post","status-publish","format-standard","hentry","category-it-2-the-tribune","category-newspapers","category-the-tribune"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1010257","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/8"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=1010257"}],"version-history":[{"count":1,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1010257\/revisions"}],"predecessor-version":[{"id":1010278,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1010257\/revisions\/1010278"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=1010257"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=1010257"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=1010257"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}