{"id":1004194,"date":"2026-04-22T07:52:08","date_gmt":"2026-04-22T02:22:08","guid":{"rendered":"https:\/\/telecomlive.in\/web\/?p=1004194"},"modified":"2026-04-22T08:09:48","modified_gmt":"2026-04-22T02:39:48","slug":"ai-chipmaker-forge-nano-to-list-via-1-6-billion-spac-deal","status":"publish","type":"post","link":"https:\/\/telecomlive.in\/web\/2026\/04\/22\/ai-chipmaker-forge-nano-to-list-via-1-6-billion-spac-deal\/","title":{"rendered":"AI chipmaker Forge Nano to list via $1.6 billion SPAC deal"},"content":{"rendered":"<p>Forge Nano, a US-based semiconductor equipment and advanced materials company, plans to go public through a $1.6 billion blank-check deal with Archimedes Tech SPAC Partners II, the companies announced on Tuesday. <\/p>\n<p>The deal comes amid booming demand for AI chips in recent years \u200cas companies \u2060ramp \u2060up spending on data centers and high-performance computing to support generative AI applications, benefiting \u200bchip firms and equipment makers across the supply chain.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Forge Nano, a US-based semiconductor equipment and advanced materials company, plans to go public through a $1.6 billion blank-check deal with Archimedes Tech SPAC Partners II, the companies announced on Tuesday. The deal comes amid booming demand for AI chips in recent years \u200cas companies \u2060ramp \u2060up spending on data centers and high-performance computing to support generative AI applications, benefiting \u200bchip firms and equipment makers across the supply chain.<\/p>\n","protected":false},"author":8,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[59,4,10],"tags":[],"class_list":["post-1004194","post","type-post","status-publish","format-standard","hentry","category-it-2-the-economic-times","category-newspapers","category-the-economic-times"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1004194","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/8"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=1004194"}],"version-history":[{"count":0,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1004194\/revisions"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=1004194"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=1004194"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=1004194"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}