TSMC, the world’s largest contract chipmaker, is expected to launch equipment installation and mass production of 3-nanometre wafers in 2028 at its second factory in Japan, according to a Taiwanese government filing late \u200con Tuesday. <\/p>\n
In \u2060February, \u2060TSMC CEO CC Wei said the company plans to mass-produce advanced 3-nanometre chips at its second fabrication plant in Japan, during a meeting with Japan’s Prime Minister Sanae Takaichi. <\/p>\n
Under the revised plan, its second chip-making plant in Japan will have a \u2060monthly production \u200ccapacity of 15,000 12-inch wafers through advanced 3-nanometre process technology, the filing said on Tuesday. <\/p>\n
TSMC’s previous plans for Japan focused on the less-advanced technologies. In 2024, the company said that total investment in the first and second fabs would exceed $20 billion, with combined monthly production capacity of 100,000 12-inch wafers using less-advanced 40, 22\/28, 12\/16 and 6\/7-nanometre process technologies. <\/p>\n
Japanese newspaper Yomiuri reported in February that investment for the second fab plant will roughly touch $17 billion, but TSMC has not disclosed the figure yet \u2060and also declined to comment on the reported investment figure. <\/p>\n
The company’s first fab plant in Japan started volume production in late 2024. <\/p>\n
TSMC established its Japan unit, Japan Advanced Semiconductor Manufacturing, in 2021 with support from Sony Semiconductor Solutions Corporation. Japan’s DENSO Corporation and Toyota Motor Corporation later joined as minority investors.<\/p>\n","protected":false},"excerpt":{"rendered":"
TSMC, the world’s largest contract chipmaker, is expected to launch equipment installation and mass production of 3-nanometre wafers in 2028 at its second factory in Japan, according to a Taiwanese government filing late \u200con Tuesday. In \u2060February, \u2060TSMC CEO CC Wei said the company plans to mass-produce advanced 3-nanometre chips at its second fabrication plant in Japan, during a meeting with Japan’s Prime Minister Sanae Takaichi. Under the revised plan, its second chip-making plant in Japan will have a \u2060monthly production \u200ccapacity of 15,000 12-inch wafers through advanced 3-nanometre process technology, the filing said on Tuesday. TSMC’s previous plans for […]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[7],"tags":[],"class_list":["post-1000931","post","type-post","status-publish","format-standard","hentry","category-it-2"],"acf":[],"_links":{"self":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1000931","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/comments?post=1000931"}],"version-history":[{"count":0,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/posts\/1000931\/revisions"}],"wp:attachment":[{"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/media?parent=1000931"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/categories?post=1000931"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/telecomlive.in\/web\/wp-json\/wp\/v2\/tags?post=1000931"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}