Apple’s M5 chips may have a new design: How can it improve next-gen iPhones and Macs

Apple is expected to change its chip design for the upcoming Mac models. Apple analyst Ming-Chi Kuo has predicted that the M5 Pro, M5 Max, and M5 Ultra chips will use a new packaging technology called System-in-Integrated-Chips-Molding-Horizontal (SoIC-mH). This technology will allow for multiple chips to be integrated into a single package, potentially improving performance and efficiency. Currently, Apple’s M-series chips are single-unit SoCs, which have contributed to their performance advantage over previous Intel processors. However, the new packaging technology will enable Apple to push the boundaries of performance and efficiency further.