US signs $6.6 bn semiconductor chip subsidy for TSMC before Trump’s return

The U.S. Commerce Department said Friday it has finalized a $6.6 billion government subsidy for Taiwan Semiconductor Manufacturing Co’s U.S. unit for semiconductor production in Phoenix, Arizona.

The binding contract – after a preliminary agreement announced in April – is the first major award to be completed under the $52.7 billion program created in 2022.