Applied Materials, Intel collaborate at EPIC Center to accelerate AI chipmaking, advanced packaging

NEW DELHI: Materials engineering major Applied Materials on Thursday announced a collaboration with Intel Corporation to accelerate the development of chipmaking innovations for next-generation transistors, interconnects, and advanced packaging technologies.

The joint effort brings together capabilities from Applied’s EPIC Center in Silicon Valley and Intel’s R&D campus in Hillsboro, Oregon, to shorten time-to-market for advanced semiconductor technologies essential to artificial intelligence computing.