Taiwan breaks ground on advanced packaging park anchored by TSMC

TAIPEI: Taiwan broke ground on a new advanced packaging industrial park in the southern city of Kaohsiung on Monday, where TSMC plans to establish facilities for technology validation and talent training.

TSMC, the world’s largest contract chipmaker, will build two buildings at the Baipu Industrial Park, including a technology validation laboratory and a talent training centre, Kaohsiung Deputy Mayor Lo Ta-sheng said at the groundbreaking ceremony. The facilities are expected to begin operations in the fourth quarter of 2029.