SK hynix launches USD 3.87 billion US HBM packaging project in Indiana

Seoul [South Korea], August 27 (ANI): South Korean chipmaker SK hynix on Thursday formally launched its USD 3.87 billion advanced chip packaging project in Indiana, a facility that is set to produce the first high bandwidth memory (HBM) in the United States, The Korea Herald reported.

As per report, the groundbreaking ceremony was held at Purdue University in West Lafayette, Indiana, more than two years after SK hynix announced the investment in April 2024.