Equipment, talent availability likely challenges to India’s semiconductor fab ambitions: IEEE

India’s semiconductor ambitions may run into challenges, including equipment and talent, while transitioning towards advanced node chips, said a senior executive at the Institute of Electrical and Electronics Engineers (IEEE).

“The challenge lies in the technology node we want to achieve. When we talk about very advanced nodes and emerging technology nodes, the fabrication challenges are significant,” Santhosh Sivasubramani, senior member, IEEE, told ETElectronicsWorld in an interview.

The US-based IEEE runs roadmap groups that forecast technology evolutions, drive the development of standards, and develop international roadmaps for devices, systems, and semiconductors.

Furthermore, there are hurdles in setting up advanced greenfield facilities that require the “right instruments” and trained personnel to operate them, he said. “You have to build a skilled workforce capable of managing these operations.”

The Centre in July approved the Semicon 2.0 programme with a financial outlay of ₹1.27 lakh crore, which will have a focus on developing six key segments: design; machines and materials; establishment of more fabs; strengthening domestic OSAT/ATMP ecosystem; research and development; and talent development.

The first-edition of the ambitious semiconductor initiative has attracted over ₹1.64 lakh crore in investment from a clutch of international and domestic manufacturers. Of these, the US-based Micron Technology, Kaynes, and CG Semi have started commercial production, while another will begin operations this year.

India’s semiconductor journey has started with 28nm to 110nm as the node, with the government now aspiring to develop more advanced nodes in collaboration with homegrown and multinational innovation centres.

The capital-intensive semiconductor foundries, at present, operate in a handful of countries including China, the United States (US), South Korea, and Taiwan. India’s first fab is scheduled to be commissioned in 2028.

However, the IEEE executive said that India will gradually transition to the semiconductor fab phase. “We are not trying to make everything indigenous from day one. We started with packaging, and now the next focus would be on fabrication.”

Furthermore, the Indian industry is actively working on materials discovery to reduce dependence on materials sourced from restricted regions, such as China, to become more self-reliant, according to IEEE.

“We need to compete with advanced economies at scale. We have the resources, we have a huge market, and now we are trying to capitalise on those strengths,” Sivasubramani said, adding that the India Semiconductor Mission (ISM) 2.0 would address some industry-wide bottlenecks.

“The administrative and technical challenges have been clearly laid out, and we are on the right track. That is how I see the future of ISM 2.0.”

“We bring together working groups from across the globe, particularly in India, along with the IEEE Standards Association office, as well as leaders, so that they can identify the potential pitfalls and what needs to be overcome,” Sivasubramani said. “It is so that we can overcome limitations and develop completely indigenous, sovereign solutions.”