Samsung stacks high-bandwidth memory chips on top of AI chips in 3D memory push, promises up to eightfold performance

Seoul [South Korea], August 5 (ANI): Samsung Electronics is placing high-bandwidth memory directly on top of AI processors as part of a 3D memory architecture push designed to lower power consumption and deliver faster data transfers, according to a news report by The Korea Herald.

The tech giant unveiled concept models of two 3D architectures, dubbed zHBM and zNAND-O, at the Future of Memory and Storage 2026 event held at the Santa Clara Convention Centre in California. Samsung described both concept models as industry firsts.