Samsung Elec wins $200 billion Broadcom AI chip partnership, boosting foundry push

SEOUL: Samsung Electronics said on Saturday it struck a pact with U.S. chip designer Broadcom to widen cooperation across memory chips, contract chip making and advanced packaging envisaged to exceed $200 billion until 2030.

Winning long-term production commitments from Broadcom, one of the world’s leading custom AI chip designers, could boost utilisation ‌at Samsung’s ⁠advanced manufacturing ⁠facilities to pull ahead in the race to supply AI chips.