Amkor, Nvidia ink $1.5 billion advanced chip packaging deal

NEW DELHI: Amkor Technology on Thursday entered into a multi-year agreement with Nvidia worth $1.5 billion to expand advanced semiconductor packaging and test capacity in the US.

Under the agreement, Nvidia will provide a prepayment to support the expansion of Amkor’s US advanced packaging capacity, including in Arizona, according to a joint statement.

The companies further said they will align their long-term roadmaps to advance technologies, including high-density interconnects and next-generation heterogeneous integration.