Besi orders more than double as AI and hybrid bonding tech drive demand

BE Semiconductor Industries (Besi) on Thursday reported quarterly orders significantly above last year’s level, fuelled by strong demand for AI, hybrid bonding, photonics and data centres.

Investors are betting on rising demand for Besi’s hybrid bonding solutions, a chip-packaging technology that enables two chips to ‌be directly ⁠bonded together, ⁠citing the company’s first-mover advantage as AI-driven demand accelerates.